I think measurement of these signals from an observability perspective, just goes from hard to almost impossible, in terms of monitoring live signals. If you can’t measure it, you can’t affect it. Steve Rumsby: Make sure you’re doing the right things to qualify your PHY, continue to monitor your PHY. Rodgers: What are the changes needed for the signal and protocol traffic generation suppliers to keep pace with the technology advances? That’s a quick rundown, of some of the ways that test and measurement (T&M) and test instrumentation will have to evolve in the next five years.ĭavid J. How are we going to get a clocker curve to work on that? These are challenges that keep us up at night. And then there’s a clocker curve that comes with 96 gigabaud PAM-5. Basic things like, will you go to a PAM-5 or a PAM-6 signal, is very real on deck right now, because again, you can’t really go fast. And that’s going to lead to a whole different set of testing problems from instrumentation, particularly with regards to signal access. We’re going to see people using XSR and similar short reach, very high speed and BUS architectures that are just millimeters long on organic substrates. So, we’re going to see the weak link going away. People are going through all sorts of back flips to push a 53 gigabit stream out through a 40 gigahertz spigot, which is really about as good as it gets out of packaging today. John Calvin: There are a lot of different things that are holding the industry back, The really the big roadblock now is the packaging, it’s not instrumentation on the other side of it. Rodgers: How are physical layer test practices evolving to meet the technological challenges of the next Ethernet reign? I would say that’s probably the biggest difference.ĭavid J. But now with this integration, you need to have all those parameters surrounding your process to be collected as well, if you want to be able to correlate the data between diverse stages. You finish a component, what do you do? You keep your pass/fail data, your birth certificate, you store data on a network somewhere, and unless you have an issue, you’re not going to look at it again. If you look today, pretty much every vendor is the same. But what was the temperature at the coupling when you did the curing? How long did you do the curing? All those little accessory data points that you may not have thought of collecting to do root cause analysis for example, am I seeing this condition because it didn’t cure long enough? I’ve seen that before where we question “what was the root cause of that?” We need to have all the environment information in which the test was performed, not only the test data itself. When packaging the die, at the CM, for example, you’re going to measure typically insertion loss when you put a coupling device. It’s almost more about what’s surrounding the data. If you test the transceiver, you’re still going to need to test optical output power, your wavelength, central wavelength, and calibration data. Rodgers: What kind of data do we need to collect, and how that’s different from yesterday to today?įrancois Robitaille: I wouldn’t say data is fundamentally different. The Future of Test Tools: Keeping Pace with Technologyĭavid J. Their insightful responses are captured below in the first of this two-part series. Discussions of the current state of play, and how test and measurement must evolve to keep pace with market and technology demands attracted strong audience interest and reaction.Īt the presentation’s conclusion, panelists answered numerous questions about the test and measurement developments needed to address escalating speed and bandwidth requirements of the next era of Ethernet. The panel emphasized critical impacts, from increased signaling speeds, to growing port counts with higher density, to standards and interoperability conformance.
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In Test & Measurement: Planning for Performance panel discussion, moderator and Ethernet Alliance Events Chair David Rodgers of Teledyne LeCroy, along with panelists John Calvin of Keysight Technologies (Validating Methods for Emerging 106Gbps Electrical and Optical Specifications relating to IEEE P802.3cu/P802.3ck) Steve Rumsby, Spirent ( Recommended Design Practices for the Next Generation Ethernet Rate) and Francois Robitaille, EXFO ( Full Compliance Validation of Next-Gen Transceivers) explored the diverse market drivers influencing test and measurement. The final day of the Ethernet Alliance’s TEF21: The Road Ahead forum was punctuated by a lively discussion on performance planning in test and measurement. Market Drivers Impacting Test & Measurement David Rodgers, Ethernet Alliance Events Chair and Teledyne LeCroy
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